Hua Fan, Jiangming Wang, University of Electronic Science and Technology of China, China; Dezhi Xing, Chongqing United Microelectronics Center, China; Ke Zhang, Chengdu HiWafer Semiconductor Co., Ltd., China; Jia Zhang, Shanghai Anlogic Info Technology Co., Ltd, China; Quanyuan Feng, School of Information Science and Technology, Southwest Jiaotong University, China